WL 2 in1 CPU NAND BGA Reballing Stencil Platfrom for iPhone 6, 6S,7, 8,X, XR, XS, Xs, Max
Reference: BG0052-G269966422
Condition: New product
Delivery by: Jun 11 2026
0.1-0.12mm thickness, high hardness, hardly deformed, increase the success rate on BGA reballing Solder working,
it is the top quality BGA Reballing Stencil for iphone CPU and NAND, A9 / A8 /A10/A11/A12
WL Top quality Fast Speed BGA reballing Solder template stencil
Note:
When you purchase this product for the first time, you must first purchase the magnetic base
Magnetic base + positioning plate + tin mesh （Together to use,)
149 Units In Stock